Invention Grant
- Patent Title: Component mounting apparatus and method
- Patent Title (中): 组件安装装置及方法
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Application No.: US12935640Application Date: 2009-03-30
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Publication No.: US08646171B2Publication Date: 2014-02-11
- Inventor: Nobuhiko Muraoka , Syozo Kadota
- Applicant: Nobuhiko Muraoka , Syozo Kadota
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-094796 20080401; JP2008-094807 20080401
- International Application: PCT/JP2009/001452 WO 20090330
- International Announcement: WO2009/122711 WO 20091008
- Main IPC: H05K13/04
- IPC: H05K13/04

Abstract:
A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing a working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing the working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.
Public/Granted literature
- US20110023296A1 COMPONENT MOUNTING APPARATUS AND METHOD Public/Granted day:2011-02-03
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