Invention Grant
- Patent Title: Device and method for mounting electronic components
- Patent Title (中): 用于安装电子元件的装置和方法
-
Application No.: US13381245Application Date: 2010-05-07
-
Publication No.: US08646174B2Publication Date: 2014-02-11
- Inventor: Kenichi Kaida , Hideki Sumi , Masahiro Kihara , Kenichirou Ishimoto , Noboru Higashi
- Applicant: Kenichi Kaida , Hideki Sumi , Masahiro Kihara , Kenichirou Ishimoto , Noboru Higashi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2009-153379 20090629
- International Application: PCT/JP2010/003147 WO 20100507
- International Announcement: WO2011/001583 WO 20110106
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/20

Abstract:
An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item. In a mounting availability determining process, an availability of an execution of a mounting operation for the mounting object component is automatically determined based on preset failure patterns of the detection result.
Public/Granted literature
- US20120102726A1 DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS Public/Granted day:2012-05-03
Information query