Invention Grant
- Patent Title: Method of preparing a composition in blister packages
- Patent Title (中): 在泡罩包装中制备组合物的方法
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Application No.: US12142506Application Date: 2008-06-19
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Publication No.: US08646246B2Publication Date: 2014-02-11
- Inventor: Hewei Li , Congwei Wang , Bo Du , Chenggong Jia , Shirong Jiao , Chun Ji
- Applicant: Hewei Li , Congwei Wang , Bo Du , Chenggong Jia , Shirong Jiao , Chun Ji
- Applicant Address: CN Beijing
- Assignee: Quantum Hi-Tech (Beijing) Research Institute
- Current Assignee: Quantum Hi-Tech (Beijing) Research Institute
- Current Assignee Address: CN Beijing
- Agency: Jun He Law Offices P.C.
- Agent Zhaohui Wang
- Priority: CN200510129999 20051219
- Main IPC: B65B55/14
- IPC: B65B55/14

Abstract:
The present invention provides methods for preparing compositions in blister packages using complex aluminum substrate materials, wherein said complex aluminum substrate materials comprise an intermediate aluminum layer, and first and second outer layers, wherein the material of the first outer layer differs from that of the second outer layer, and the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-30%.
Public/Granted literature
- US20080305289A1 METHOD OF PREPARING A COMPOSITION IN BLISTER PACKAGES Public/Granted day:2008-12-11
Information query
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