A housing for an electronic device as well as methods for forming the housing are disclosed. The housing can be formed from a substrate having perforations to assist in adhering components internal to the housing. The substrate is typically a multi-layer substrate having at least two layers. In one embodiment, an inner layer of the multi-layer substrate can be provided with perforations. The perforations can them be used to adhere internal features to the multi-layer substrate. The internal features can be used for attaching parts or components to the multi-layer substrate, thereby securing the parts or components to the multi-layer substrate and thus the housing.