Invention Grant
- Patent Title: Housingless connector
- Patent Title (中): 无接头连接器
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Application No.: US13551832Application Date: 2012-07-18
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Publication No.: US08647129B2Publication Date: 2014-02-11
- Inventor: Takuya Takahashi , Ryuzo Shimeno , Tetsuya Komoto , Osamu Hashiguchi
- Applicant: Takuya Takahashi , Ryuzo Shimeno , Tetsuya Komoto , Osamu Hashiguchi
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP2011-203457 20110916
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween.
Public/Granted literature
- US20130072037A1 HOUSINGLESS CONNECTOR Public/Granted day:2013-03-21
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