Invention Grant
- Patent Title: Board-to-board connector assembly
- Patent Title (中): 板对板连接器组件
-
Application No.: US13533665Application Date: 2012-06-26
-
Publication No.: US08647141B2Publication Date: 2014-02-11
- Inventor: Kuo-Ching Lee , Conrad Yee Yang Choy , Jian-Li Guan , Ya-Ping Liang , Ta-Teh Meng
- Applicant: Kuo-Ching Lee , Conrad Yee Yang Choy , Jian-Li Guan , Ya-Ping Liang , Ta-Teh Meng
- Applicant Address: TW New Taipei
- Assignee: Advanced Connectek Inc.
- Current Assignee: Advanced Connectek Inc.
- Current Assignee Address: TW New Taipei
- Agency: Sinorica, LLC
- Agent Ming Chow
- Priority: CN201220124243 20120329
- Main IPC: H01R13/62
- IPC: H01R13/62

Abstract:
A board-to-board connector assembly has a female connector and a male connector. The female connector has a first insulative housing, multiple first terminals and a latching bar. The first insulative housing has a locking recess and a releasing recess. The latching bar is mounted pivotally on the first insulative housing and selectively engages the locking recess or releasing recess. The male connector has a second insulative housing, multiple second terminals and two latched elements. The latched elements are mounted in the second insulative housing and each latched element has a latched hole selectively engaging with the latching bar to prevent the male connector from falling out of the female connector.
Public/Granted literature
- US20130260594A1 BOARD-TO-BOARD CONNECTOR ASSEMBLY Public/Granted day:2013-10-03
Information query