Invention Grant
- Patent Title: Polishing pad of polishing system
- Patent Title (中): 抛光系统抛光垫
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Application No.: US13769029Application Date: 2013-02-15
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Publication No.: US08647178B2Publication Date: 2014-02-11
- Inventor: Kyoung-Hoon Min , Ye-Hoon Im , Dae-Yeon Lee , Jae-Ik Song , Su-Chan Park
- Applicant: LG Chem, Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2010-0079882 20100818
- Main IPC: B24D11/00
- IPC: B24D11/00
Abstract:
A polishing pad of a polishing system is mountable to a polishing plate and has a predetermined channel pattern so as to allow a polishing liquid supplied from a polishing liquid supplier to move on a polishing surface. The channel pattern has at least two kinds of patterns.
Public/Granted literature
- US20130196580A1 POLISHING PAD OF POLISHING SYSTEM Public/Granted day:2013-08-01
Information query
