Invention Grant
- Patent Title: Method for forming transparent conductive layer pattern
- Patent Title (中): 形成透明导电层图案的方法
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Application No.: US13379815Application Date: 2010-06-29
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Publication No.: US08647463B2Publication Date: 2014-02-11
- Inventor: Yoshikazu Yamazaki , Satoshi Hayakawa , Masashi Miyamoto
- Applicant: Yoshikazu Yamazaki , Satoshi Hayakawa , Masashi Miyamoto
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-155181 20090630
- International Application: PCT/JP2010/061026 WO 20100629
- International Announcement: WO2011/001961 WO 20110106
- Main IPC: B32B3/00
- IPC: B32B3/00

Abstract:
Provided is a low-cost method for easily forming a transparent conductive pattern that has a low electrical resistance and high transparency, and that is highly invisible to the eye. The method for forming a transparent conductive layer pattern includes the steps of (1) detachably forming a transparent conductive layer on a substrate; (2) then forming, on a support, a negative-patterned heat-sensitive adhesive image; (3) bonding the substrate to the support so that the transparent conductive layer and the heat-sensitive adhesive layer are in close contact with each other; (4) forming a pattern of the transparent conductive layer on the substrate by detaching the support from the substrate to transfer a portion of the transparent conductive layer, the portion being in close contact with the heat-sensitive adhesive layer, to the heat-sensitive adhesive layer; and (5) fixing the transparent conductive layer on the substrate by applying a coating material for a protective layer onto a front surface of the substrate on which the pattern of the transparent conductive layer is formed and impregnating the transparent conductive layer with the coating material.
Public/Granted literature
- US20120094090A1 METHOD FOR FORMING TRANSPARENT CONDUCTIVE LAYER PATTERN Public/Granted day:2012-04-19
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