Invention Grant
- Patent Title: Method for manufacturing friction material, friction material and braking device
- Patent Title (中): 制造摩擦材料，摩擦材料和制动装置的方法
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Application No.: US13142470Application Date: 2009-06-15
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Publication No.: US08647546B2Publication Date: 2014-02-11
- Inventor: Kenji Abe , Hiroshi Isono , Yoshitomo Denou
- Applicant: Kenji Abe , Hiroshi Isono , Yoshitomo Denou
- Applicant Address: JP Aichi-ken
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Aichi-ken
- Agency: Sughrue Mion, PLLC
- International Application: PCT/JP2009/060864 WO 20090615
- International Announcement: WO2010/146664 WO 20101223
- Main IPC: B29C70/64
- IPC: B29C70/64 ; B29C39/02
Abstract:
A plurality of hard particles 102 is arranged in a mold 302 which suppresses movement of the hard particles 102 so as to be close to each other, and the hard particles 102 arranged in the mold 302 are fixed with resin 103, thereby forming a friction surface 101. Therefore, a pad 100a in which the plurality of hard particles 102 is arranged on the friction surface 101 can be more easily manufactured.
Public/Granted literature
- US20110275547A1 METHOD FOR MANUFACTURING FRICTION MATERIAL, FRICTION MATERIAL AND BRAKING DEVICE Public/Granted day:2011-11-10
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