Invention Grant
- Patent Title: Adhesive preparation
- Patent Title (中): 粘合剂制备
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Application No.: US12309226Application Date: 2007-06-27
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Publication No.: US08647664B2Publication Date: 2014-02-11
- Inventor: Sachiko Honma , Tetsuro Tateishi
- Applicant: Sachiko Honma , Tetsuro Tateishi
- Applicant Address: JP Tosu-Shi, Saga
- Assignee: Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee: Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee Address: JP Tosu-Shi, Saga
- Agency: Nath, Goldberg & Meyer
- Agent Sheldon M. McGee
- Priority: JPP2006-194624 20060714
- International Application: PCT/JP2007/062906 WO 20070627
- International Announcement: WO2008/007554 WO 20080117
- Main IPC: A61F13/02
- IPC: A61F13/02 ; A61L15/16 ; A61F13/00 ; A61K31/445

Abstract:
A patch preparation having a backing layer and a drug layer laminated on the backing layer; wherein the drug layer contains an adhesive containing at least one compound selected from the group consisting of fentanyl and pharmaceutically acceptable salts thereof, polyisobutylene, and a silicon-containing polymer; and a mass ratio of the polyisobutylene and the silicon-containing polymer in the adhesive is 20:1 to 7:3.
Public/Granted literature
- US20090246263A1 Adhesive preparation Public/Granted day:2009-10-01
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