Invention Grant
- Patent Title: Wafer with recessed plug
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Application No.: US13232268Application Date: 2011-09-14
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Publication No.: US08647930B2Publication Date: 2014-02-11
- Inventor: Andrew B. Graham , Gary Yama , Gary O'Brien
- Applicant: Andrew B. Graham , Gary Yama , Gary O'Brien
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot, Moore & Beck
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84

Abstract:
In one embodiment, a method of forming a plug includes providing a base layer, providing an intermediate oxide layer above an upper surface of the base layer, providing an upper layer above an upper surface of the intermediate oxide layer, etching a trench including a first trench portion extending through the upper layer, a second trench portion extending through the oxide layer, and a third trench portion extending into the base layer, depositing a first material portion within the third trench portion, depositing a second material portion within the second trench portion, and depositing a third material portion within the first trench portion.
Public/Granted literature
- US20120261800A1 WAFER WITH RECESSED PLUG Public/Granted day:2012-10-18
Information query
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