Invention Grant
US08647949B2 Structure and method of fabricating a transistor having a trench gate
失效
制造具有沟槽栅极的晶体管的结构和方法
- Patent Title: Structure and method of fabricating a transistor having a trench gate
- Patent Title (中): 制造具有沟槽栅极的晶体管的结构和方法
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Application No.: US13017629Application Date: 2011-01-31
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Publication No.: US08647949B2Publication Date: 2014-02-11
- Inventor: Michael Smith , Mark Helm , Kirk Prall
- Applicant: Michael Smith , Mark Helm , Kirk Prall
- Applicant Address: US NJ Jersey City
- Assignee: Round Rock Research, LLC
- Current Assignee: Round Rock Research, LLC
- Current Assignee Address: US NJ Jersey City
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
An integrated circuit transistor is fabricated with a trench gate having nonconductive sidewalls. The transistor is surrounded by an isolation trench filled with a nonconductive material. The sidewalls of the gate trench are formed of the nonconductive material and are substantially free of unetched substrate material. As a result, the sidewalls of the gate trench do not form an undesired conductive path between the source and the drain of the transistor, thereby advantageously reducing the amount of parasitic current that flows between the source and drain during operation.
Public/Granted literature
- US20110124178A1 STRUCTURE AND METHOD OF FABRICATING A TRANSISTOR HAVING A TRENCH GATE Public/Granted day:2011-05-26
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