Invention Grant
- Patent Title: Electroless plating in microchannels
- Patent Title (中): 微通道中的化学镀
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Application No.: US11549625Application Date: 2006-10-13
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Publication No.: US08648006B2Publication Date: 2014-02-11
- Inventor: Francis P. Daly , Richard Long , Junko Ida , Rachid Taha , Terry Mazanec , Barry L. Yang
- Applicant: Francis P. Daly , Richard Long , Junko Ida , Rachid Taha , Terry Mazanec , Barry L. Yang
- Applicant Address: US OH Plain City
- Assignee: Velocys, Inc.
- Current Assignee: Velocys, Inc.
- Current Assignee Address: US OH Plain City
- Agent Frank Rosenberg
- Main IPC: B01J23/42
- IPC: B01J23/42 ; B01J23/46 ; B01J8/02
Abstract:
Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.
Public/Granted literature
- US20080214884A1 Electroless plating in microchannels Public/Granted day:2008-09-04
Information query
