Invention Grant
- Patent Title: AMTEC power system with thermal block
- Patent Title (中): AMTEC电力系统带热块
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Application No.: US12564586Application Date: 2009-09-22
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Publication No.: US08648245B1Publication Date: 2014-02-11
- Inventor: Mark D. Bennett
- Applicant: Mark D. Bennett
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agent Diane M. Tsuda
- Main IPC: H01L35/30
- IPC: H01L35/30
Abstract:
An AMTEC power system including a housing that defines a cold chamber and a hot chamber, an insulative material disposed between the cold chamber and the hot chamber, the insulative material including carbon foam, and at least one AMTEC cell received in the housing, the AMTEC cell extending into both the cold chamber and the hot chamber.
Information query
IPC分类:
