Invention Grant
US08648278B2 Process for producing substrate provided with metal pattern and substrate provided with metal laminate 失效
具有设置有金属图案的基板的制造方法和设置有金属层叠体的基板

Process for producing substrate provided with metal pattern and substrate provided with metal laminate
Abstract:
The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of forming on the metal layer an assist layer which comprises a metal material different from that of the metal layer and which has a light absorptivity for the laser light different from that of the metal layer, thereby forming a metal laminate on the substrate; and a step of patterning the metal layer by irradiating the metal laminate with the laser light to remove a laser light-irradiated portion of the metal laminate, thereby forming a metal pattern on the substrate.
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