Invention Grant
US08648278B2 Process for producing substrate provided with metal pattern and substrate provided with metal laminate
失效
具有设置有金属图案的基板的制造方法和设置有金属层叠体的基板
- Patent Title: Process for producing substrate provided with metal pattern and substrate provided with metal laminate
- Patent Title (中): 具有设置有金属图案的基板的制造方法和设置有金属层叠体的基板
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Application No.: US13082799Application Date: 2011-04-08
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Publication No.: US08648278B2Publication Date: 2014-02-11
- Inventor: Guangyao Niu
- Applicant: Guangyao Niu
- Applicant Address: JP Tokyo
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-089595 20100408
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of forming on the metal layer an assist layer which comprises a metal material different from that of the metal layer and which has a light absorptivity for the laser light different from that of the metal layer, thereby forming a metal laminate on the substrate; and a step of patterning the metal layer by irradiating the metal laminate with the laser light to remove a laser light-irradiated portion of the metal laminate, thereby forming a metal pattern on the substrate.
Public/Granted literature
- US20110249340A1 PROCESS FOR PRODUCING SUBSTRATE PROVIDED WITH METAL PATTERN AND SUBSTRATE PROVIDED WITH METAL LAMINATE Public/Granted day:2011-10-13
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