Invention Grant
- Patent Title: Process control apparatus and laser processing apparatus
- Patent Title (中): 过程控制装置和激光加工装置
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Application No.: US12936120Application Date: 2009-04-03
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Publication No.: US08648279B2Publication Date: 2014-02-11
- Inventor: Keiji Takahashi , Tomonori Mukae , Shigeru Yokoi , Tatsuya Yamamoto
- Applicant: Keiji Takahashi , Tomonori Mukae , Shigeru Yokoi , Tatsuya Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-098524 20080404
- International Application: PCT/JP2009/001575 WO 20090403
- International Announcement: WO2009/122758 WO 20091008
- Main IPC: B23K26/04
- IPC: B23K26/04

Abstract:
A process control apparatus controls a focus position of a laser beam, while a laser processing mechanism converges the laser beam into a predetermined focus position and performs a laser processing on a workpiece. The process control apparatus includes: a calculator that, based on the magnitude of an output of the laser beam that changes during the laser processing, calculates a change amount of a positional deviation of the focus position in an optical axis direction that changes during the laser processing at a laser beam radiation position; and a control unit that, based on the change amount of the positional deviation that has been calculated by the calculator, controls the focus position of the laser beam during the laser processing so as to resolve the positional deviation of the focus position.
Public/Granted literature
- US20110042360A1 PROCESS CONTROL APPARATUS AND LASER PROCESSING APPARATUS Public/Granted day:2011-02-24
Information query
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