Invention Grant
US08648302B2 Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method 失效
热检测器,热检测装置,电子仪器和热检测器制造方法

  • Patent Title: Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
  • Patent Title (中): 热检测器,热检测装置,电子仪器和热检测器制造方法
  • Application No.: US13329518
    Application Date: 2011-12-19
  • Publication No.: US08648302B2
    Publication Date: 2014-02-11
  • Inventor: Yasushi Tsuchiya
  • Applicant: Yasushi Tsuchiya
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Global IP Counselors, LLP
  • Priority: JP2010-286334 20101222; JP2010-289491 20101227; JP2010-289492 20101227; JP2011-012060 20110124; JP2011-036886 20110223
  • Main IPC: G01J5/00
  • IPC: G01J5/00
Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
Abstract:
A thermal detector includes a substrate; a support member supported on the substrate with a cavity interposed therebetween; a heat-detecting element formed on the support member; a first light-absorbing layer formed on the heat-detecting element and the support member so as to be in contact with the heat-detecting element; and a second light-absorbing layer formed on the first light-absorbing layer so as to be in contact with the first light-absorbing layer. The second light-absorbing layer has a higher refractive index than the first light-absorbing layer. A first wavelength resonates between a surface of the support member and an upper surface of the second light-absorbing layer, and a second wavelength, which is different from the first wavelength, resonates between an interface, at which the first light-absorbing layer and the second light-absorbing layer are in contact with each other, and the upper surface of the second light-absorbing layer.
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