Invention Grant
- Patent Title: Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
- Patent Title (中): 热检测器,热检测装置,电子仪器和热检测器制造方法
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Application No.: US13329518Application Date: 2011-12-19
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Publication No.: US08648302B2Publication Date: 2014-02-11
- Inventor: Yasushi Tsuchiya
- Applicant: Yasushi Tsuchiya
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2010-286334 20101222; JP2010-289491 20101227; JP2010-289492 20101227; JP2011-012060 20110124; JP2011-036886 20110223
- Main IPC: G01J5/00
- IPC: G01J5/00

Abstract:
A thermal detector includes a substrate; a support member supported on the substrate with a cavity interposed therebetween; a heat-detecting element formed on the support member; a first light-absorbing layer formed on the heat-detecting element and the support member so as to be in contact with the heat-detecting element; and a second light-absorbing layer formed on the first light-absorbing layer so as to be in contact with the first light-absorbing layer. The second light-absorbing layer has a higher refractive index than the first light-absorbing layer. A first wavelength resonates between a surface of the support member and an upper surface of the second light-absorbing layer, and a second wavelength, which is different from the first wavelength, resonates between an interface, at which the first light-absorbing layer and the second light-absorbing layer are in contact with each other, and the upper surface of the second light-absorbing layer.
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