Invention Grant
US08648304B1 Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method 失效
热检测器,热检测装置,电子仪器和热检测器制造方法

  • Patent Title: Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
  • Patent Title (中): 热检测器,热检测装置,电子仪器和热检测器制造方法
  • Application No.: US14050630
    Application Date: 2013-10-10
  • Publication No.: US08648304B1
    Publication Date: 2014-02-11
  • Inventor: Yasushi Tsuchiya
  • Applicant: Seiko Epson Corporation
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Global IP Counselors, LLP
  • Priority: JP2010-286334 20101222; JP2010-289491 20101227; JP2010-289492 20101227; JP2011-012060 20110124; JP2011-036886 20110223
  • Main IPC: G01J5/08
  • IPC: G01J5/08
Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
Abstract:
A thermal detector manufacturing method includes: forming a sacrificial layer on a structure including an insulating layer; forming a support member on the sacrificial layer; forming on the support member a heat-detecting element; forming a first light-absorbing layer so as to cover the heat-detecting element, and planarizing the first light-absorbing layer; forming a contact hole in a portion of the first light-absorbing layer, subsequently forming a thermal transfer member having a connecting portion that connects to the heat-detecting element and a thermal collecting portion having a surface area greater than that of the connecting portion as seen in plan view; forming a second light-absorbing layer on the first light-absorbing layer; and removing the sacrificial layer to form a cavity between the support member and the structure including the insulating layer formed on the surface of the substrate.
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