Invention Grant
US08648328B2 Light emitting diode (LED) using three-dimensional gallium nitride (GaN) pillar structures with planar surfaces
有权
使用具有平面表面的三维氮化镓(GaN)柱结构的发光二极管(LED)
- Patent Title: Light emitting diode (LED) using three-dimensional gallium nitride (GaN) pillar structures with planar surfaces
- Patent Title (中): 使用具有平面表面的三维氮化镓(GaN)柱结构的发光二极管(LED)
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Application No.: US13367120Application Date: 2012-02-06
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Publication No.: US08648328B2Publication Date: 2014-02-11
- Inventor: Mark Albert Crowder , Changqing Zhan , Paul J. Schuele
- Applicant: Mark Albert Crowder , Changqing Zhan , Paul J. Schuele
- Applicant Address: US WA Camas
- Assignee: Sharp Laboratories of America, Inc.
- Current Assignee: Sharp Laboratories of America, Inc.
- Current Assignee Address: US WA Camas
- Agency: Law Office of Gerald Maliszewski
- Agent Gerald Maliszewski
- Main IPC: H01L33/04
- IPC: H01L33/04

Abstract:
A method is provided for fabricating a light emitting diode (LED) using three-dimensional gallium nitride (GaN) pillar structures with planar surfaces. The method forms a plurality of GaN pillar structures, each with an n-doped GaN (n-GaN) pillar and planar sidewalls perpendicular to the c-plane, formed in either an m-plane or a-plane family. A multiple quantum well (MQW) layer is formed overlying the n-GaN pillar sidewalls, and a layer of p-doped GaN (p-GaN) is formed overlying the MQW layer. The plurality of GaN pillar structures are deposited on a first substrate, with the n-doped GaN pillar sidewalls aligned parallel to a top surface of the first substrate. A first end of each GaN pillar structure is connected to a first metal layer. The second end of each GaN pillar structure is etched to expose the n-GaN pillar second end and connected to a second metal layer.
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