Invention Grant
- Patent Title: Semiconductor device, electronic device, and method of manufacturing semiconductor device
- Patent Title (中): 半导体器件,电子器件和半导体器件的制造方法
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Application No.: US13241577Application Date: 2011-09-23
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Publication No.: US08648346B2Publication Date: 2014-02-11
- Inventor: Toshiyuki Isa , Masafumi Morisue , Ikuko Kawamata
- Applicant: Toshiyuki Isa , Masafumi Morisue , Ikuko Kawamata
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2005-022248 20050128
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L31/036 ; H01L31/0376 ; H01L31/20

Abstract:
To provide a semiconductor device and a display device which can be manufactured through a simplified process and the manufacturing technique. Another object is to provide a technique by which a pattern of wirings or the like which is partially constitutes a semiconductor device or a display device can be formed with a desired shape with controllability.
Public/Granted literature
- US20120012846A1 SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2012-01-19
Information query
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