Invention Grant
- Patent Title: Lighting emitting device package
- Patent Title (中): 照明发光装置封装
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Application No.: US12706431Application Date: 2010-02-16
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Publication No.: US08648365B2Publication Date: 2014-02-11
- Inventor: Jung Min Won
- Applicant: Jung Min Won
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2009-0013155 20090217
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Disclosed is a light emitting device package. The light emitting device package includes a package body including a cavity formed therein with first and second via holes, a first electrode extending from one side of the cavity to one side of a rear surface of the package body through the first via hole, a second electrode extending from an opposite side of the cavity to an opposite side of the rear surface of the package body through the second via hole, a light emitting device connected with the first and second electrodes, an insulating layer insulating the first and second electrodes from the package body, and a reflective layer disposed on the insulating layer having a structure in which first and second media having different refractive indexes are alternately stacked on each other.
Public/Granted literature
- US20100207152A1 LIGHTING EMITTING DEVICE PACKAGE Public/Granted day:2010-08-19
Information query
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