Invention Grant
- Patent Title: Semiconductor light emitting device and light emitting module
- Patent Title (中): 半导体发光器件和发光模块
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Application No.: US13601336Application Date: 2012-08-31
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Publication No.: US08648375B2Publication Date: 2014-02-11
- Inventor: Hideto Furuyama , Akihiro Kojima , Miyoko Shimada , Yosuke Akimoto , Hideyuki Tomizawa
- Applicant: Hideto Furuyama , Akihiro Kojima , Miyoko Shimada , Yosuke Akimoto , Hideyuki Tomizawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2012-120547 20120528
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first and second surfaces, and a light emitting layer; a p-side electrode provided on the second surface; an n-side electrode provided on the second surface; a first insulating film covering the p-side and the n-side electrodes; a p-side wiring section electrically connected to the p-side electrode through the first insulating film; an n-side wiring section electrically connected to the n-side electrode through the first insulating film; and a phosphor layer provided on the first surface. The phosphor layer has an upper surface and an oblique surface, the oblique surface forming an obtuse angle with the upper surface and inclined with respect to the first surface. Thickness of the phosphor layer immediately below the oblique surface is smaller than thickness of the phosphor layer immediately below the upper surface.
Public/Granted literature
- US20130313581A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE Public/Granted day:2013-11-28
Information query
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