Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13301973Application Date: 2011-11-22
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Publication No.: US08648385B2Publication Date: 2014-02-11
- Inventor: Kenji Kouno , Hiromitsu Tanabe , Yukio Tsuzuki
- Applicant: Kenji Kouno , Hiromitsu Tanabe , Yukio Tsuzuki
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2010-262395 20101125; JP2011-233682 20111025
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes a semiconductor substrate with a first surface and a second surface. The semiconductor substrate has an element region including an IGBT region and a diode region located adjacent to the IGBT region. An IGBT element is formed in the IGBT region. A diode element is formed in the diode region. A heavily doped region of first conductivity type is located on the first surface side around the element region. An absorption region of first conductivity type is located on the second surface side around the element region. A third semiconductor region of second conductivity type is located on the second surface side around the element region.
Public/Granted literature
- US20120132954A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-05-31
Information query
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