Invention Grant
US08648437B2 Trench sidewall contact Schottky photodiode and related method of fabrication
有权
沟槽侧壁接触肖特基光电二极管及相关制造方法
- Patent Title: Trench sidewall contact Schottky photodiode and related method of fabrication
- Patent Title (中): 沟槽侧壁接触肖特基光电二极管及相关制造方法
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Application No.: US12790390Application Date: 2010-05-28
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Publication No.: US08648437B2Publication Date: 2014-02-11
- Inventor: Massimo Cataldo Mazzillo
- Applicant: Massimo Cataldo Mazzillo
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.R.L.
- Current Assignee: STMicroelectronics S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: ITVA2009A0033 20090601
- Main IPC: H01L27/095
- IPC: H01L27/095 ; H01L29/47 ; H01L29/812 ; H01L31/07 ; H01L31/108

Abstract:
A Schottky photodiode may include a monocrystalline semiconductor substrate having a front surface, a rear surface, and a first dopant concentration and configured to define a cathode of the Schottky photodiode, a doped epitaxial layer over the front surface of the monocrystalline semiconductor substrate having a second dopant concentration less than the first dopant concentration, and parallel spaced apart trenches in the doped epitaxial layer and having of a depth less than a depth of the doped epitaxial layer. The Schottky photodiode may include a metal filler in the parallel spaced apart trenches to form a Schottky rectifying contact with the doped epitaxial layer, an anode current distributor metal layer on a surface of the doped epitaxial layer and in electrical contact with the metal filler of the parallel spaced apart trenches, a dielectric passivation layer on the anode current distributor metal layer, and a conductive metal layer over the rear surface of the monocrystalline semiconductor substrate and configured to provide an ohmic contact with the cathode.
Public/Granted literature
- US20100301445A1 TRENCH SIDEWALL CONTACT SCHOTTKY PHOTODIODE AND RELATED METHOD OF FABRICATION Public/Granted day:2010-12-02
Information query
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