Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12037620Application Date: 2008-02-26
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Publication No.: US08648442B2Publication Date: 2014-02-11
- Inventor: Seiichi Hirabayashi
- Applicant: Seiichi Hirabayashi
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2007-045633 20070226
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A semiconductor device having a transistor circuit and a bleeder resistance circuit is provided in which fluctuations in resistance value of a bleeder resistor are reduced. In the transistor circuit, a barrier metal film and a interconnect film are layered as a metal film on an interlayer insulating film above transistor structure. In the bleeder resistance circuit, the interconnect film is layered as a metal film on the interlayer insulating film above the bleeder resistor formed from polysilicon film. Alternatively, the metal film in the bleeder resistance circuit includes the barrier metal film only in a portion where the metal film is connected to the bleeder resistor. This reduces stress to the bleeder resistor formed from a polysilicon film, and the resistance value of the bleeder resistor accordingly fluctuates less. In addition, since the metal film used as interconnect of the transistor circuit includes the barrier metal film, interconnect reliability is not impaired.
Public/Granted literature
- US20080203532A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2008-08-28
Information query
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