Invention Grant
- Patent Title: Wiring pattern for touch integrated circuit
- Patent Title (中): 触摸集成电路接线图
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Application No.: US13851254Application Date: 2013-03-27
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Publication No.: US08648457B2Publication Date: 2014-02-11
- Inventor: Chin-Fu Chang
- Applicant: Egalax—Empia Technology Inc.
- Applicant Address: TW Taipei
- Assignee: Egalax—Empia Technology Inc.
- Current Assignee: Egalax—Empia Technology Inc.
- Current Assignee Address: TW Taipei
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW101150796A 20121228
- Main IPC: G06F3/044
- IPC: G06F3/044 ; H01L23/482 ; H03K17/96
Abstract:
Electrodes on a touch sensor are connected with pins of an integrated circuit by wires. The wires connecting a first side of the integrated circuit go under the integrated circuit to the electrodes, and wires connecting a second side of the integrated circuit have segments extending away from the touch sensor under the integrated circuit.
Public/Granted literature
- US20130256111A1 WIRING PATTERN FOR TOUCH INTEGRATED CIRCUIT Public/Granted day:2013-10-03
Information query
