A semiconductor chip package including a film substrate and a semiconductor chip loaded on the semiconductor chip is provided. The semiconductor chip includes a plurality of input pads and a plurality of output pads. A power supply input pad of the input pads is formed at a different edge from an edge of the semiconductor chip where other input pads are formed. The film substrate includes input lines and output lines. The input lines of the film substrate are connected to the corresponding input pads of the semiconductor chip, and the output lines thereof are connected to the corresponding output pads of the semiconductor chip.