A method of testing a multi-die integrated circuit (IC) can include testing an inter-die connection of the multi-die IC. The inter-die connection can include a micro-bump coupling a first die to a second die. The method can include detecting whether a fault occurs during testing of the inter-die connection. Responsive to detecting the fault, the multi-die integrated circuit can be designated as including a faulty inter-die connection. Also described is an integrated circuit that includes a first die, a second die on which the first die may be disposed, a plurality of inter-die connections coupling the first die to the second die, and a plurality of probe pads, where each probe pad is coupled to at least one of the inter-die connections.