Invention Grant
- Patent Title: Mutual inductance circuits
- Patent Title (中): 互感电路
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Application No.: US13250455Application Date: 2011-09-30
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Publication No.: US08648664B2Publication Date: 2014-02-11
- Inventor: Adam B. Eldredge , Susumu Hara
- Applicant: Adam B. Eldredge , Susumu Hara
- Applicant Address: US TX Austin
- Assignee: Silicon Laboratories Inc.
- Current Assignee: Silicon Laboratories Inc.
- Current Assignee Address: US TX Austin
- Agency: Abel Law Group, LLP
- Main IPC: H03B5/08
- IPC: H03B5/08 ; H01F27/28

Abstract:
An apparatus includes a first conductive loop coupled to conduct a first current and a second conductive loop coupled in parallel with the first conductive loop and further coupled to conduct a second current. A first conductive portion forms a part of the first conductive loop and the second conductive loop. The first conductive portion is coupled to conduct the first current and the second current. In at least one embodiment of the apparatus, the first conductive loop and the second conductive loop are planar inductors formed in a conductive layer on a substrate of an integrated circuit.
Public/Granted literature
- US20130082793A1 Mutual Inductance Circuits Public/Granted day:2013-04-04
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