Invention Grant
- Patent Title: Elastic wave apparatus with a floating wiring line on a base substrate
- Patent Title (中): 弹性波装置,在基底上具有浮动布线
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Application No.: US13606364Application Date: 2012-09-07
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Publication No.: US08648673B2Publication Date: 2014-02-11
- Inventor: Masashi Omura
- Applicant: Masashi Omura
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-054074 20100311
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H9/08 ; H03H9/72

Abstract:
A small-sized elastic wave apparatus in which heat generated at a portion of a cascade connection between resonators is sufficiently dissipated includes on one main surface of a piezoelectric substrate in an elastic wave filter mounted on a base substrate on which an input/output wiring line, a ground wiring line, and a floating wiring line insulated from the input/output wiring line and the ground wiring line are provided, first electrodes coupled to the input/output wiring line or the ground wiring line, second electrodes coupled to the floating wiring line, resonators, connection wiring lines connecting the resonators, and electrode wiring lines connecting the resonators and the first electrodes. The second electrodes are disposed in contact with the connection wiring lines cascading the resonators.
Public/Granted literature
- US20120326810A1 ELASTIC WAVE APPARATUS Public/Granted day:2012-12-27
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