Invention Grant
- Patent Title: Combined serial/parallel light configuration and single layer PCB containing the same
- Patent Title (中): 组合串/并联光配置和单层PCB包含相同
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Application No.: US13678226Application Date: 2012-11-15
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Publication No.: US08648993B2Publication Date: 2014-02-11
- Inventor: William Dunn , David Williams
- Applicant: Manufacturing Resources International, Inc.
- Applicant Address: US GA Alpharetta
- Assignee: Manufacturing Resources International, Inc.
- Current Assignee: Manufacturing Resources International, Inc.
- Current Assignee Address: US GA Alpharetta
- Agency: Standley Law Group LLP
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; H05B37/02 ; A61N5/06

Abstract:
An LED circuit using a combination of series and parallel arrangements for optimum current sharing between LEDs. The current paths allow an LED to fail while minimizing the effect on other LEDs and noticeable luminance variance across the circuit. Some embodiments use metallic PCB technology which permits optimal thermal regulation of heat generated by the LEDs. Exemplary embodiments can be used with a single-layer PCB where only one layer of conducting material must be placed on the substrate. A constricted convection plate may be positioned behind the rear surface of the PCB to define a channel. One or more fans may be positioned to force cooling air through the channel. An LCD assembly using the same is also disclosed.
Public/Granted literature
- US20130278867A1 COMBINED SERIAL/PARALLEL LIGHT CONFIGURATION AND SINGLE LAYER PCB CONTAINING THE SAME Public/Granted day:2013-10-24
Information query
IPC分类: