Invention Grant
US08649123B1 Method to eliminate reactive ion etching (RIE) loading effects for damascene perpendicular magnetic recording (PMR) fabrication 有权
消除用于大马士革垂直磁记录(PMR)制造的反应离子蚀刻(RIE)负载效应的方法

Method to eliminate reactive ion etching (RIE) loading effects for damascene perpendicular magnetic recording (PMR) fabrication
Abstract:
A method for providing a perpendicular magnetic recording (PMR) head is disclosed. The method comprises: providing an insulating layer; covering the insulating layer with a hard mask material; forming a pre-defined shape in the hard mask material; forming a pole trench and a yoke area in the insulating layer by a first reactive ion etching (RIE) process in which the yoke area includes a loading prevention pattern; performing a wet etching process to remove the hard mask material from the pole trench and the yoke area; performing a second RIE process to remove the loading prevention pattern of the yoke area, wherein the pole trench and the remainder of the yoke area are not removed and remain having similar side wall angles; and providing a PMR pole in which at least a portion of the PMR pole resides in the pole trench.
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