An electronic component includes a ceramic body including first to fourth side surfaces, a first external electrode provided on one side surface of the ceramic body, a second external electrode, and a plurality of reinforcing electrodes. Each of the first and second external electrodes includes a thick-film electrode layer including sintered metal, a plated layer arranged so as to cover the thick-film electrode layer, an external electrode main body portion covering the side surface of the ceramic body, and turnback portions extending to the top surface and the bottom surface of the ceramic body. An end portion of at least one reinforcing electrode of the plurality of reinforcing electrodes is exposed on the top surface or the bottom surface of the ceramic body on the center portion of the ceramic body in relation to the thick-film electrode layer in the turnback portion.