Invention Grant
- Patent Title: Semiconductor module device and driving apparatus having the same
- Patent Title (中): 半导体模块装置及其驱动装置
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Application No.: US13068194Application Date: 2011-05-04
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Publication No.: US08649159B2Publication Date: 2014-02-11
- Inventor: Toshihiro Fujita , Hiroyasu Kidokoro , Hiromasa Hayashi
- Applicant: Toshihiro Fujita , Hiroyasu Kidokoro , Hiromasa Hayashi
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2010-117689 20100521
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K7/02
Abstract:
A controller has a control board, a power module and a power board. MOS transistors, inverter input terminals, coil terminals, inverter ground terminals, control terminals, a control power input terminal and a control ground terminal are integrally molded in a molded portion of a power module. Electrical connections between the power module and the control and power boards are made through the terminals provided in the molded portion.
Public/Granted literature
- US20110285336A1 Semiconductor module device and driving apparatus having the same Public/Granted day:2011-11-24
Information query
