Invention Grant
- Patent Title: Heat dissipation module for electronic apparatus
- Patent Title (中): 电子设备散热模块
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Application No.: US12944727Application Date: 2010-11-12
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Publication No.: US08649178B2Publication Date: 2014-02-11
- Inventor: Ching-Yuan Huang , Chang-Yuan Wu , I-Feng Hsu , Tzu-Chang Chen
- Applicant: Ching-Yuan Huang , Chang-Yuan Wu , I-Feng Hsu , Tzu-Chang Chen
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure. When the extending portion is forced to move along a direction away from the heat-generating structure and the heat dissipation structure, the heat-conducting portion is deformed to release the adhesion between the heat-conducting portion and the heat-generating structure and the adhesion between the heat-conducting portion and the heat dissipation structure.
Public/Granted literature
- US20110116238A1 HEAT DISSIPATION MODULE FOR ELECTRONIC APPARATUS Public/Granted day:2011-05-19
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