Invention Grant
- Patent Title: Electronic assembly
- Patent Title (中): 电子组装
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Application No.: US13024818Application Date: 2011-02-10
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Publication No.: US08649183B2Publication Date: 2014-02-11
- Inventor: Rodney Austin Green , Kevin Craig Bellette , Perry Arthur Kelly
- Applicant: Rodney Austin Green , Kevin Craig Bellette , Perry Arthur Kelly
- Applicant Address: AU Cannington
- Assignee: Mulpin Research Laboratories, Ltd.
- Current Assignee: Mulpin Research Laboratories, Ltd.
- Current Assignee Address: AU Cannington
- Agent Joseph Stecewycz
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.
Public/Granted literature
- US20120205147A1 ELECTRONIC ASSEMBLY Public/Granted day:2012-08-16
Information query
