Invention Grant
- Patent Title: Method and device for controlling circuit board positions during the assembly of electronic components
- Patent Title (中): 在组装电子元件期间控制电路板位置的方法和装置
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Application No.: US13166244Application Date: 2011-06-22
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Publication No.: US08649894B2Publication Date: 2014-02-11
- Inventor: Tomohiko Hattori , Hiroshi Tsuta
- Applicant: Tomohiko Hattori , Hiroshi Tsuta
- Applicant Address: JP Chiryu-shi
- Assignee: Fuji Machine Mfg. Co., Ltd.
- Current Assignee: Fuji Machine Mfg. Co., Ltd.
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-160691 20100715
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B23P19/00 ; H05K3/30 ; H01L21/68 ; H01R43/20
Abstract:
A method for controlling a board stopping position includes a calculation step for calculating an extended length of the electronic component mounted on the board and extended from the board end portion in the transfer direction by one of the electronic component mounting machines; and a correcting and stopping step for correcting a stopping timing of the conveyer belt to be stopped in response to the detection signal which is outputted from the board sensor and stopping the board at the mounting position, based on the calculated extended length of the electronic component in a subsequent stage electronic component mounting machine arranged subsequent to the one of the electronic component mounting machines.
Public/Granted literature
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