Invention Grant
US08649895B2 Managing method of building material and wireless chip applied to the method
有权
建筑材料和无线芯片的管理方法应用于该方法
- Patent Title: Managing method of building material and wireless chip applied to the method
- Patent Title (中): 建筑材料和无线芯片的管理方法应用于该方法
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Application No.: US11402361Application Date: 2006-04-12
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Publication No.: US08649895B2Publication Date: 2014-02-11
- Inventor: Yoshinobu Asami
- Applicant: Yoshinobu Asami
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2005-121686 20050419
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A lot of buildings have been built while it is concerned that a building material is used fraudulently. Therefore, the present invention provides a managing method of the material and a system thereof. The present invention provides a managing method including a step of attaching a sheet including a plurality of memories to each surface of a plurality of materials, a step of dividing the plurality of materials with the sheet in accordance with data in the memory, a step of constructing a building by using the divided material in accordance with the data in the memory, and a step of checking the data on the constructed building, which is stored in the plurality of memories.
Public/Granted literature
- US20060231974A1 Managing method of building material and wireless chip applied to the method Public/Granted day:2006-10-19
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