Invention Grant
US08650387B2 IC chip, information processing apparatus, software module control method, information processing system, information processing method, and program 有权
IC芯片,信息处理装置,软件模块控制方法,信息处理系统,信息处理方法和程序

  • Patent Title: IC chip, information processing apparatus, software module control method, information processing system, information processing method, and program
  • Patent Title (中): IC芯片,信息处理装置,软件模块控制方法,信息处理系统,信息处理方法和程序
  • Application No.: US13062464
    Application Date: 2009-09-11
  • Publication No.: US08650387B2
    Publication Date: 2014-02-11
  • Inventor: Hirokazu Sugiyama
  • Applicant: Hirokazu Sugiyama
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: K&L Gates LLP
  • Priority: JPP2008-235286 20080912
  • International Application: PCT/JP2009/065890 WO 20090911
  • International Announcement: WO2010/029987 WO 20100318
  • Main IPC: G06F9/00
  • IPC: G06F9/00 G06F15/177
IC chip, information processing apparatus, software module control method, information processing system, information processing method, and program
Abstract:
An IC chip, an information processing apparatus, a software module control method, an information processing system, an information processing method, and a program for ensuring security before booting a software module reliably are provided. A reader/writer and a mobile phone terminal to be accessed by the reader/writer through proximity communication are provided. In the mobile phone terminal, a first software module transmits commands to second and third software modules. The first software module manages states of the second and third software modules. If during boot-up of the third software module, the processing of the second software module is started and completed, then the first software module resumes the boot-up of the third software module.
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