Invention Grant
US08650387B2 IC chip, information processing apparatus, software module control method, information processing system, information processing method, and program
有权
IC芯片,信息处理装置,软件模块控制方法,信息处理系统,信息处理方法和程序
- Patent Title: IC chip, information processing apparatus, software module control method, information processing system, information processing method, and program
- Patent Title (中): IC芯片,信息处理装置,软件模块控制方法,信息处理系统,信息处理方法和程序
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Application No.: US13062464Application Date: 2009-09-11
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Publication No.: US08650387B2Publication Date: 2014-02-11
- Inventor: Hirokazu Sugiyama
- Applicant: Hirokazu Sugiyama
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2008-235286 20080912
- International Application: PCT/JP2009/065890 WO 20090911
- International Announcement: WO2010/029987 WO 20100318
- Main IPC: G06F9/00
- IPC: G06F9/00 ; G06F15/177

Abstract:
An IC chip, an information processing apparatus, a software module control method, an information processing system, an information processing method, and a program for ensuring security before booting a software module reliably are provided. A reader/writer and a mobile phone terminal to be accessed by the reader/writer through proximity communication are provided. In the mobile phone terminal, a first software module transmits commands to second and third software modules. The first software module manages states of the second and third software modules. If during boot-up of the third software module, the processing of the second software module is started and completed, then the first software module resumes the boot-up of the third software module.
Public/Granted literature
Information query