Invention Grant
- Patent Title: Thermal processing and consolidation system and method
- Patent Title (中): 热处理和固结系统及方法
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Application No.: US13290867Application Date: 2011-11-07
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Publication No.: US08650745B2Publication Date: 2014-02-18
- Inventor: Ronald M. Jacobsen , Antonin Pelc , Calvin D. Bamford, Jr. , Terrance William Cooke , Victor Wayne Croston , Russell Carver Warrick
- Applicant: Ronald M. Jacobsen , Antonin Pelc , Calvin D. Bamford, Jr. , Terrance William Cooke , Victor Wayne Croston , Russell Carver Warrick
- Applicant Address: US WA Tacoma
- Assignee: Globe Machine Manufacturing Company
- Current Assignee: Globe Machine Manufacturing Company
- Current Assignee Address: US WA Tacoma
- Agency: Lowe, Hauptman & Ham, LLP
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A thermal processing and consolidation system is provided that includes an upper chamber assembly lower chamber assembly, layup and demolding station, transfer assembly, automatic or permanent coupling system, and controller. The upper and lower chamber assemblies are coupled to form an enclosed plenum operable to maintain a pressurized environment about a tool. The layup and demolding station receives the tool and facilitates the layup, bagging and sealing of unprocessed components at the tool. A transfer assembly accurately positions the tool on the lower chamber assembly in alignment with the upper chamber assembly. An automatic or permanent coupling system provides services to the tool and the enclosed plenum. A controller directs services to be supplied to the enclosed plenum and tool in accordance with a set of process parameters. This set of process parameters allows an individual set of unprocessed components to be thermally processed and consolidated.
Public/Granted literature
- US20120114973A1 THERMAL PROCESSING AND CONSOLIDATION SYSTEM AND METHOD Public/Granted day:2012-05-10
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