Invention Grant
- Patent Title: Fluid supply
- Patent Title (中): 流体供应
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Application No.: US13055693Application Date: 2009-07-01
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Publication No.: US08651130B2Publication Date: 2014-02-18
- Inventor: Ronald J. Ender , Craig L. Malik , Norman E. Pawlowski , Benjamin Zoladz
- Applicant: Ronald J. Ender , Craig L. Malik , Norman E. Pawlowski , Benjamin Zoladz
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2009/049416 WO 20090701
- International Announcement: WO2010/014341 WO 20100204
- Main IPC: B67D7/72
- IPC: B67D7/72
Abstract:
A fluid supply includes a container (100, 300) containing a bag (102, 302) and a valve (104, 304).
Public/Granted literature
- US20110120572A1 FLUID SUPPLY Public/Granted day:2011-05-26
Information query
IPC分类:
