Invention Grant
US08651360B2 Systems and methods for processing ribbon and wire in ultrasonic bonding systems
有权
超声波粘结系统中色带和线材的处理系统和方法
- Patent Title: Systems and methods for processing ribbon and wire in ultrasonic bonding systems
- Patent Title (中): 超声波粘结系统中色带和线材的处理系统和方法
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Application No.: US13979269Application Date: 2012-01-12
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Publication No.: US08651360B2Publication Date: 2014-02-18
- Inventor: Vahid Safavi Ardebili
- Applicant: Vahid Safavi Ardebili
- Applicant Address: US CA Irvine
- Assignee: Orthodyne Electronics Corporation
- Current Assignee: Orthodyne Electronics Corporation
- Current Assignee Address: US CA Irvine
- Agent Christopher M. Spletzer, Sr.
- International Application: PCT/US2012/021057 WO 20120112
- International Announcement: WO2012/099771 WO 20120726
- Main IPC: B23K1/06
- IPC: B23K1/06 ; B23K31/02
Abstract:
An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.
Public/Granted literature
- US20130292456A1 SYSTEMS AND METHODS FOR PROCESSING RIBBON AND WIRE IN ULTRASONIC BONDING SYSTEMS Public/Granted day:2013-11-07
Information query
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