Invention Grant
- Patent Title: Housing for an electronic device
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Application No.: US13656168Application Date: 2012-10-19
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Publication No.: US08651592B1Publication Date: 2014-02-18
- Inventor: Chun Fei Yang , Jung Chun Chen
- Applicant: Chun Fei Yang , Jung Chun Chen
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: Fortkort & Houston P.C.
- Agent John A. Fortkort
- Main IPC: A47B97/00
- IPC: A47B97/00

Abstract:
A housing for an electronic device includes a housing body, a bottom cover, and a locking member. The housing body includes an engaging slot and a through hole. The bottom cover includes an engaging hook for engaging the engaging slot. An inner surface of the housing body or the bottom cover is provided with a positioning element. The locking member extends through the through hole, and includes an engaging portion disposed on the inner surface of the housing body, and a control portion exposed from the through hole. The control portion is operable to move the engaging portion between a locking position where the engaging portion engages the positioning element and an unlocking position where the engaging portion is separated from the positioning element to thereby facilitate assembly and disassembly of the bottom cover to and from the housing body.
Information query