Invention Grant
- Patent Title: Ejection liquid dryness suppressing device, liquid ejecting apparatus, and ejection liquid dryness suppressing method
- Patent Title (中): 喷射液干燥抑制装置,液体喷射装置和喷射液干燥抑制方法
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Application No.: US13151460Application Date: 2011-06-02
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Publication No.: US08651620B2Publication Date: 2014-02-18
- Inventor: Yoichi Yamada , Yoshiyuki Kurebayashi , Masaru Kobashi
- Applicant: Yoichi Yamada , Yoshiyuki Kurebayashi , Masaru Kobashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-128012 20100603
- Main IPC: B41J2/135
- IPC: B41J2/135 ; B41J2/165

Abstract:
There is provided a nozzle contact unit capable of realizing a contact state, where a contact surface comes into close contact with a nozzle formation surface to block a plurality of nozzle openings, and a separated state, where the contact surface is separated from the nozzle formation surface. The nozzle contact unit separates the contact surface from the nozzle formation surface to sequentially open the nozzle openings preferentially from the nozzle opening of the nozzle with a shorter flow passage length of ink flowing from a supply port to the nozzle via a common ink chamber among the plurality of nozzle openings in a procedure from the contact state to the separated state.
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Information query
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