Invention Grant
- Patent Title: Sensor temperature sensing device
- Patent Title (中): 传感器温度检测装置
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Application No.: US12821637Application Date: 2010-06-23
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Publication No.: US08651737B2Publication Date: 2014-02-18
- Inventor: Barrett E. Cole , Robert Higashi , Peter Tobias
- Applicant: Barrett E. Cole , Robert Higashi , Peter Tobias
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G01K7/00
- IPC: G01K7/00

Abstract:
The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.
Public/Granted literature
- US20110317739A1 SENSOR TEMPERATURE SENSING DEVICE Public/Granted day:2011-12-29
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