Invention Grant
- Patent Title: Self deploying implant in needle
- Patent Title (中): 自行部署植入物针
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Application No.: US12938474Application Date: 2010-11-03
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Publication No.: US08652216B2Publication Date: 2014-02-18
- Inventor: Steve Chen , Ryan Dempsey , Jeffrey Miller , Amy Overby
- Applicant: Steve Chen , Ryan Dempsey , Jeffrey Miller , Amy Overby
- Applicant Address: US IN West Lafayette
- Assignee: Cook Biotech Incorporated
- Current Assignee: Cook Biotech Incorporated
- Current Assignee Address: US IN West Lafayette
- Agency: Woodard, Emhardt, Moriarty, McNett & Henry LLP
- Main IPC: A61F2/02
- IPC: A61F2/02

Abstract:
Described, in certain inventive embodiments, are unique devices and methods for introducing implants into soft tissue of a patient. One of these devices includes a tissue-penetrating member that is configured to pass in its entirety through a volume of patient tissue. The tissue-penetrating member has a leading end and a trailing end, and provides a receiving space for receipt of an implant body portion for carrying the implant body portion into the volume of patient tissue. The device also includes an implant that has an implant body portion removably received in the receiving space of the tissue-penetrating member. The implant body portion is configured for deployment from the receiving space in the volume of patient tissue so as to remain deployed there along a passageway traversed by the tissue-penetrating member.
Public/Granted literature
- US20110093088A1 SELF DEPLOYING IMPLANT IN NEEDLE Public/Granted day:2011-04-21
Information query
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