Invention Grant
- Patent Title: Chia seed composition
- Patent Title (中): ia种子组成
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Application No.: US12349100Application Date: 2009-01-06
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Publication No.: US08652544B2Publication Date: 2014-02-18
- Inventor: John A. Minatelli , W. Stephen Hill , Rudi Moerck , Uy Nguyen
- Applicant: John A. Minatelli , W. Stephen Hill , Rudi Moerck , Uy Nguyen
- Applicant Address: US FL Eustis
- Assignee: U.S. Nutraceuticals, LLC
- Current Assignee: U.S. Nutraceuticals, LLC
- Current Assignee Address: US FL Eustis
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: A61K36/00
- IPC: A61K36/00
Abstract:
A composition of matter is disclosed and formed from a stable, defatted whole grain flour derived from Salvia hispanica L. whole ground seed using a suitable solvent that is free of cyanogenic glycosides, vitamin antagonists, and gluten. The composition includes minerals, about 30% wt/wt protein, about 30-40% insoluble fiber and about 2-3% of fructo-oligosaccarides.
Public/Granted literature
- US20090181127A1 CHIA SEED COMPOSITION Public/Granted day:2009-07-16
Information query
