Invention Grant
- Patent Title: Heat conductive dielectric polymer material and heat dissipation substrate containing the same
- Patent Title (中): 导热介电聚合物材料和散热基板含有相同的
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Application No.: US13109284Application Date: 2011-05-17
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Publication No.: US08652641B2Publication Date: 2014-02-18
- Inventor: David Shau Chew Wang , Yi An Sha , Kuo Hsun Chen
- Applicant: David Shau Chew Wang , Yi An Sha , Kuo Hsun Chen
- Applicant Address: TW Hsinchu
- Assignee: Polytronics Technology Corp.
- Current Assignee: Polytronics Technology Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B27/38
Abstract:
A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.
Public/Granted literature
- US20110214852A1 HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME Public/Granted day:2011-09-08
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