A method for making a microfluidic device, the method includes providing at least one inorganic layer on a substrate; applying an alkoxysilane material containing a primary or secondary amine on the at least one inorganic layer; baking the applied alkoxysilane material at a temperature greater than 130 degrees C.; applying an epoxy material to form an epoxy layer, wherein the applied alkoxysilane material is disposed at an interface between the epoxy layer and the at least one inorganic layer; and patterning the epoxy layer to provide a wall for defining a location for a fluid in the microfluidic device.