Invention Grant
- Patent Title: Chip testing method
- Patent Title (中): 芯片测试方法
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Application No.: US13445283Application Date: 2012-04-12
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Publication No.: US08652858B2Publication Date: 2014-02-18
- Inventor: Eon-Jo Byun , Yang-Gi Kim
- Applicant: Eon-Jo Byun , Yang-Gi Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0058050 20110615
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A chip testing method includes cutting a wafer into chip packages, re-arranging the chip packages on a chip tray, and testing the re-arranged chip packages. The wafer includes a plurality of substrates vertically stacked thereon, and each of the plurality of substrates has a plurality of chips mounted thereon.
Public/Granted literature
- US20120322174A1 CHIP FIXING APPARATUS AND CHIP TESTING METHOD USING THE SAME Public/Granted day:2012-12-20
Information query
IPC分类:
